CMA Operating Manual:Canon Mask Aligner Introduction Use the Canon PLA-501F Mask Aligner (See Fig. 1:Right View) whenever you have a process flow that requires more than one mask on a wafer. If it is critical to align these masks with each other, you must use this tool. The Northern California Nanotechnology Center has two Aligners, both are
stage, relative to mask and optics. ALIGNMENT MODE button (red) (Located on manipulator) Moves aligner between contact and separate states. When in contact, the wafer cannot be moved relative to the mask. When in separate, the wafer may be aligned without damage. Indicator lights indicate in which state the aligner is operating. EVG 620 MASK ALIGNMENT SYSTEM OPERATING 2.4 Manual substrate and mask loading 2.5 High resolution top and bottom side split field microscopes 2.6 Alignment stage precision micrometers 3.0 REQUIREMENTS 3.1 Training All users must be trained and authorized on the EVG 620 Mask Aligner to use this system. Training is supplied by a Nanofab staff member please contact the
2.4 Manual substrate and mask loading 2.5 High resolution top and bottom side split field microscopes 2.6 Alignment stage precision micrometers 3.0 REQUIREMENTS 3.1 Training All users must be trained and authorized on the EVG 620 Mask Aligner to use this system. Training is supplied by a Nanofab staff member please contact the EVG 620 Manual Mask Aligner ClassOne EquipmentEVG 620 MASK ALIGNER consisting of:- Model:EVG620 - Manual Mask Aligner - Topside Alignment (TSA) - Automatic Alignment - Up to 6"/150mm Wafer Capable (with proper chuck) - Objectives (Qty 2) - Vacuum Chuck:request at time of order - Maskholder:request at time of order - Mask Load Frame:request at time of order
EVG 620 MASK ALIGNER consisting of:- Model:EVG 620 - Manual Mask Aligner- Topside Alignment (TSA)- Manual Alignment- Up to 6'/150mm Wafer Capable (with proper Equipment Nanofabrication FacilityThe Mask Aligner (tool #15A) is a Quintel Model Q4000-6. This supplemental Aligner is also a contact printer capable of 1 micron resolution like the Suss MA6. Configured with Deep UV exposure, and UV/IR backside alignment capability, this system will provide a redundant tool
Exporter of Lithography, Sputtering System & Manual Mask Aligner offered by Indo French High Tech Equipments from Mumbai, Maharashtra, India Instruction for the Mask Aligner (Quintel Q-4000IR)Instruction for the Mask Aligner (Quintel Q-4000IR) 15. With the COARSE ALIGNMENT button (to the left of the mask holder) pressed down, use the ALIGNMENT JOYSTICK (to the right of the mask holder) to center the vacuum chuck in the hole on the mask holder. This
View and Download Karl Suss MA6 operating manual online. Mask Aligner. MA6 Laboratory Equipment pdf manual download. KARL SUSS MA6/BA6 Mask Aligner Users ManualPage 1 KARL SUSS MA6/BA6 Mask Aligner Users Manual . Coral name:Suss MA6 Model:KARL SUSS MASK ALIGNER MA6/BA6 Location:Nanofab, Building 215, Room A102 Contact:[email protected] . Version:1.0
The SUSS MJB3 UV400 mask aligner is designed for high resolution photolithography in a laboratory environment. The MJB3 mask aligner offers exceptional flexibility in the processing of irregular shaped samples of different thickness such as sample wafer pieces and glass slides up to standard size 2 diameter wafers. KARL SUSS MJB3 UV400 Mask Aligner Standard follow the procedures set forth in the manufacturers maintenance and operations manuals. This document is for reference only. Personnel should be trained by authorized staff before operating MJB3 UV400 mask aligner. 1.2 Description The SUSS MJB3 UV400 mask aligner is designed for high resolution photolithography in a laboratory environment.
The Karl Suss Mask Aligner is the newest addition to our photolithographic machines. It has touch screen controls that allow for parameters to be changed simply and efficiently. It is equipped with a Hitachi monitor for easy to view mask and wafer alignment. Likewise, it is equipped with joystick controls that can adjust the alignment by 1 Karl Suss Contact Aligner OperationTITLE:Karl Suss Contact Aligner Operation Page 10 of 31 Document Number:SP2008-LI-002 5/1/2019 Author:Roger Robbins Loading Mask in Mask Holder The first step in running an exposure is to load your mask into the mask holder. This is accomplished by removing the mask holder from the tool and setting it upside down on the
Manual Mask AlignerThe Karl Suss MA 150M Manual Mask Aligner is a mask alignment and exposure system which offers unsurpassed precision and versatility when handling wafers up Karl Suss MA150 RevE4.3 Mask Holders - There are three different mask holders. See SMFL staff for training on changing aligner configuration. 4.3.1 Standard 5-inch mask holder for contact and proximity modes for 4 inch wafers. 4.3.2 Modified mask holder for 7-inch glass, for contact mode only on 4 and 6 inch wafers.
Karl Suss MA6 Mask Aligner Standard Operating Procedure Faculty Supervisor:Prof. Robert White, Mechanical Engineering (x72210) Safety Office:Peter Nowak x73246 (Just dial this directly on any campus phone.) (617)627-3246 (From off-campus or from a cell phone) Tufts Emergency Medical Services are at x66911. Karl Suss MA6 Mask Aligner SOPKarl Suss MA6 SOP Rev 11 - 10/07/2020 Page 1 of 11 Karl Suss MA6 Mask Aligner SOP Safety UV Exposure:The high energy light produced by the high pressure Mercury Xenon lamp can cause eye damage and skin burns.
Kasper Mask Aligner Manual 1. Introduction The Kasper Wafer Alignment System is an integrated optical-mechanical, pneumatic-electrical system which allows accurate alignment of sensitized semiconductor wafers with a mask and exposes them to ultraviolet radiation. It is a high precision piece of equipment and should be treated with care. MASK ALIGNER Service ManualMASK ALIGNER Serial No. -----Service Manual 1. GENERAL DESCRIPTION AND PRINCIPLES OF OPERATION 2. UTILITIES AND MACHINE DIMENSIONS 3. MACHINE SPECIFICATIONS 4. BASIC ADJUSTMENT PROCEDURES 5. PREVENTIVE MAINTENANCE 6. REPLACEMENT PARTS IDENTIFICATION MANUAL 7. ELECTRICAL AND PENUMATIC DRAWINGS This Service Manual is
Mask Aligner. Compare. Spin Coater. Compare. Product ListAll. MDA-400LJ. TypeFully manual; Mask sizeup to 5 inch; Substrate sizepiece to 4 inch circle; Compare Estimate. MDA-400M. TypeFully manual; Mask sizeup to 5 inch; Substrate sizepiece to 4 inch circle; Compare Estimate. MDA-400M-6. TypeFully manual; Mask sizeup to 7 inch; Substrate Ma6 Service Manual - widgets.uproxxManual M-Manual Karl Suss MJB-3 Mask Aligner Users Manual Version Date Sections Affected Author 1.0 7-17-08 All Chapters J. Pulecio KARL SUSS MA6/BA6 Mask Aligner Users Manual The service life of an LED exceeds that of conventional lamps many times over, thereby lowering costs generated by
SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as Mask Aligner - Department of Systems EngineeringMask Aligner. This machine is what actually transfers the pattern onto the wafer. A mask is placed above the wafer. The mask has the desired pattern on it. A high intensity ultraviolet light is placed over the mask. The light only transmits through the openings in the pattern allowing the pattern is burned into the photoresist on the wafer.
SMA-600M is a manual mask aligner for R&D and multiproduct production field, which adopts a clear optical system and fully non-contact calibration unit. The exposure up to 150mm wafer is capable by contact or proximity mode. It is the most suitable system in exposure process for various kinds of electronic devices such compound semiconductors Mask Aligner SUSS MicroTecManual Mask Aligner MJB4 Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer.
The NXQ8000 Production Mask Aligner Integrates the latest in Robotic Automation with a state of the art next generation design from Milara, Inc. The Dual Arm Robot delivers lightning fast wafer transfer at twice the accuracy of competitors and incorporates a pre-aligner from Logosol which can detect transparent substrates making it ideal for OAI Model 800E Mask Aligner - 4D LABSThe mask aligner will automatically perform all movements of the wafer, and will automatically align the wafer to the mask before exposure. Manual Align The mask aligner will automatically level and bring the wafer to alignment height. The joystick is enabled to control the wafer chuck.
Back to Equipment List EVG 620 Mask Aligner. Description:The EVG is stumbling on occasion. Let FABLAB staff know if you are having problems with performance. You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. Recipes:Photoresist Processes AZ4620_process.doc (25.5 KB) Q 4000-6 MASK ALIGNER - AcrosemiThe Quintel Q4000-6 Mask Aligner combines innovative design with precision alignment and exposure features. It supports both vacuum and contact printing and handles partial and whole substrates up to 150mm (6) diameter.
Re:Mask Aligner - the resolution of Karl Suss MJB 3 From:Ashutosh Shastry ([email protected]) Date:Mon Apr 16 2001 - 10:29:22 EDT Next message:[email protected]:"English manuals:TPG300 and IMG300" Previous message:Beth Fuchs:"RE:Mask Aligner - the resolution of Karl Suss MJB 3" In reply to:Yiping Lin:"Mask Aligner - the resolution of Karl Suss MJB 3" Standard Operating Manual - Hong Kong University of Karl Suss MA6 Mask Aligner . 1. Picture and Location. Th. is. tool is located at NFF Room 2240 Cleanroom Class 100. 2. Process Capabilities. 2.1. Cleanliness Standard:Suss MA6#1 Mask Aligner is classified as a Non-Standard equipment; Suss MA6#2 Mask Aligner is classified as a Clean/Semi-Clean. 2.2. Substrate Size:TSA is >5mm. 2
The Suss MA/BA6 UV 400 Mask and Bond Aligner is used to expose 4" wafers with 5" photomasks. Back side alignment is available. Limited use of smaller substrates for backside alignment may be possible with a 2" chuck, please contact BNC staff for more info if interested. Specifications. Exposure. Light source:350 W Mercury Short-arc lamp (UV400). Suss MJB4 Mask AlignerIntroduction The MJB4 Mask Aligner is a precision instrument for high-resolution photolithography and is intended for use in research laboratories, small-series production and pilot projects. It has been designed for exposing standard wafers and substrates and irregularly shaped substrates with a diameter of up to 100 mm and various thicknesses.
Large surface exposure UV high-powered system The large surface exposure system UV-KUB 9 is a cold-UV exposure system based on LED technology emitting a high power density, homogeneous and monochromatic illumination (200mW/cm² +/- 5%) at 365nm over a working surface of 9 inches. It is the ideal equipment for applications like wafer bonding, temporary bonding and blue tape exposure used [DOC]User Manual -- HTB Contact Mask Aligner · Web view6a. For glass masks, place mask face down. on mask platform (M) between the four alignment . pins. 6b. For transparency masks:Place printed transparency, print-side down, directly on wafer; make any adjustments as needed. Note:Transparency should be small enough to fit inside the mask platform hole, but large enough to cover entire wafer. Fig. 2.
The SUSS MJB 3 Mask Aligner is designed for high resolution photolithography in a laboratory, development or pilot production environment. The product fine offers unsurpassed flexibility in the handling of irregularly shaped substrates and pieces of differing thicknesses, as well as standard size wafers up to 3" in diameter.